1. Overview

  The System can accommodate a wide range of materials and process from odd sized substrates, 
  Piece to 4¡± with UV or Deep UV Exposure. The MDA-400M is being successfully used in the Manufacturing 
  of Semiconductors, Opto Electronics, Flat Panel, RF Microwave, Diffractive Optics, Mems, Bump, or Flip 
  chip devices and other Technologies requiring fine geometry printing & precision Alignment.

  2. Module

  Mask Aligner & UV Source Module : 1 qty
  Exposure system Wafer stage Module : 1 qty
  Microscope with CCD camera : 1 set
  Monitor : 1 qty
  Mask Holder : 1 qty
  Sample chuck : 1 qty
  UV lamp power supply : 1 qty
  350W UV Lamp : 1 qty
  Controller : 1 qty
  Oil-less Vacuum Pump : 1 qty

  3. Specification

  ¡Ü Standard Feature
						
  ¢Å Wafer stage								
  Substrate Size : Up to 4¡±				
  Chuck	size : Piece ~ 4¡± 
  Movement X : ¡¾5 mm  Y : ¡¾5 mm  Z : 10 mm  ¥È : ¡¾3¡Æ
  Alignment accuracy : < ¡¾1 um 
  Wafer to mask level : Air bearing type wedge compensation
  X, Y, ¥È , Z-Axis Moving : Manual micrometer
  Vacuum : Oil-less Vacuum Pump

  ¢Å Mask stage
  Mask size : Up to 7 inch
  Mask holding type : Vacuum & * clip
  Proximity Gap : Z-Axis micrometer ( Resolution 0.5 um )

  ¢Å UV source	
  UV lamp : 350 W
  Uniform beam size : 4.25¡° X 4.25¡°
  Exposure mode : Pressure ( Hard, Soft ) / Vacuum / Proximity
  Exposure time control : Changeable 
  Exposure timer : 1 ~ 999.9 sec
  Beam Intensity : 365nm Max. Intensity : 30 mw/cm2
  Wavelength : NUV 350nm ~ 450nm
  Beam Uniformity : ¡Â ¡¾3%

  ¢Å Microscope	
  Type : Dual CCD zoom Microscope 
  Monitor : 17¡± LCD Monitor 
  Video mode : Single and split field
  Magnification : 80x ~ 1,000x			 
  Focus : Manual				
  Objective spacing : Variable (60mm ~ 100mm) 
  Working distance : 86 mm / 32 mm
  Field of View : 6,9 mm ~ 0.03 mm
  Depth of Field : 2.98 mm ~ 0.03 mm
		
  ¢Å Control system
  Manual Controller

  ¢Å Mask ( User Spec )
  Pattern shape : User Spec
  Mask thickness : User Spec
  Size : up to 7¡± Mask

  ¢Å Resolution	
  Vacuum Contact :1 um ( Thin PR@Si Wafer )
  Hard Contact : 2 um
  Soft contact : 3 um			
  20 um Proximity : 5um 

  ¢Å Lamp 							
  Uniformity : 5 ~ 9 Point Standard	
  Idle Power: ~ 300 W
  Power Mode: CP (Constant Power) & CI (Constant Intensity)

  4. Utility

  1)Dimension(mm) : 1000mm*950mm*800mm [W*D*H]
  2)Electric Power : 220V, 20Amp, 50/60Hz, 1 Phase 
  3)N2 : More than 3kg/cm2 ( 40 psi ), Flow rate 5 Liter/min, Out side diameter 6 mm Tube
  4)Air: More than 5kg/cm2 ( 80 psi ), Flow rate 10 Liter/min, Out side diameter 6 mm Tube
  5)Vacuum: ¡Ã 600mmHg, ( Vacuum pump include )           
  6)Weight : Equipment : 200 kg / (With Packing : 300 kg)