1. Overview
: The System can accommodate a wide range of materials
and process from odd sized substrates, Piece to 8¡±
with UV or Deep UV Exposure. The MDA-8000B_DUV is being
successfully used in the Manufacturing of Semiconductors,
Opto Electronics, Flat Panel, RF Microwave, Diffractive Optics,
Mems, Bump or Flip chip devices and other Technologies
requiring fine geometry printing & precision Alignment.
2. Module
Mask Aligner & UV Source Module:1 qty
Exposure system Wafer stage Module:1
Microscope with CCD camera:1 set
CCD Bottom side align:1 set
Monitor:1
Mask Holder:1
Sample chuck:1
DUV lamp power supply:1
1KW DUV Lamp:2
PC:1
Anti-vibration table:1
Oil-less Vacuum Pump 1
3. Specification
¡Ü Standard Feature
¢Å Wafer stage
Substrate Size :Up to 8¡±
Chuck size :Up to 8¡±
Movement
X: ¡¾5 mm
Y: ¡¾5 mm
Z: 15 mm
¥È: ¡¾3¡Æ
Alignment accuracy TSA : < ¡¾1 um, BSA : < ¡¾3 um
Wafer to mask gap Auto wedge compensation
Vibration protection Mounted on anti-vibration table
Z-Axis Moving Motorizing
¥È -Axis Moving Motorizing
Oil-less Vacuum Pump
¢Å Mask stage
Mask size :Up to 9¡±
Mask holding type :Vacuum * clip
Proximity Gap ball :2 ¨ª ( 3 ea )
¢Å UV source
UV lamp 1KW DUV
Uniform beam size 8.25¡° X 8.25¡°
Exposure mode Pressure ( Hard, Soft ) / Vacuum / Proximity
Exposure time control Changeable
Exposure timer 1 ~ 999.9 sec
Beam Intensity 365nm Max. Intensity : 15~20 mw/cm2
248nm Max. Intensity : 10~12 mw/cm2
Wavelength NUV 350nm ~ 450nm
Beam Uniformity ¡Â ¡¾5%
¢Å Microscope
Type Dual CCD zoom Microscope
Monitor 17¡± LCD Monitor
Video mode Single and split field
Magnification 80x ~ 1,000x
Focus Manual
Objective spacing Variable (25mm ~ 200mm)
Angle prism
Working distance 86 mm / 32 mm
Field of View 6,9 mm ~ 0.03 mm
Depth of Field 2.98 mm ~ 0.03 mm
¢Å Bottom Side Alignment
Bottom Side CCD microscope Set
Motorizing Control Dual X,Y,Z Motion
Objective spacing 80 ~ 100 ( @ 6inch wafer chuck )
Magnification 400x
Working distance 25 mm
Image capture
Align accuracy <¡¾ 3 um
¢Å Control system
PC & PLC Controller
¢Å Mask ( User Spec )
Pattern shape :User Spec
Mask thickness :User Spec
Size: up to 9¡± Mask
¢Å Resolution
Vacuum Contact 1um ( Thin PR@Si Wafer )
Hard Contact 2 um
Soft contact 3 um
20 um Proximity 5um
¢Å Lamp
Uniformity: 5 ~ 9 Point Standard
Idle Power:750mw
Power Mode:CP (Constant Power) & CI (Constant Intensity)
4. Utility
1)Dimension(mm) : 810mm*980mm*1800mm[W*D*H]
2)Electric Power : 220V, 30Amp, 50/60Hz, 1 Phase
3)N2 : More than 3kg/cm2 ( 40 psi ), Flow rate 5 Liter/min
Out side diameter 6 mm Tube
4)Air : More than 6kg/cm2 ( 80 psi ), Flow rate 10 Liter/min
Out side diameter 6 mm Tube
5)Vacuum: ¡Ã 600mmHg, ( Vacuum pump include )
6)Exhuast: Lamp House Cooling
? Flexible Duct Al hose inside diameter 100mm
? Flow rate 10 Liter/min
7)Weight : Equipment : 600 kg
With Packing : 800 kg
